Electronic Integration Inc. provides PCB
assembly solutions including: state-of-the-art,
quick turn and prototype printed circuit board
assembly. We have both conventional through-hole
and state-of-the-art surface mount technologies
and can assemble and test a wide range of
high complexity boards. This includes double-sided
reflow, fine pitch and BGA technologies.
* Surface Mount
A utomated high-speed pick and place lines
with "vision centering." Capable
of placing components ranging from 0402s to
12 mil pitch devices. Production capability
from low to high volume runs using either
water soluble or nonclean paste.
* Through-hole
Wave solder available for both aqueous or
"no clean" flux. Full hand assembly
push line with axial and radial parts preparation.
Mechanical thruhole assembly involves hardware
such as screws, nuts, and bolts.
* Testing
In-circuit and functional testing capabilities
performed upon request.
* Other Capabilities
- Fine pitch placement to 10 mil
- Ball Grid array placement and rework
- Mechanical assembly
- Paste –in-hole- Reflow
- No clean flux
- Selective wave solder
- Closed loop Aqueous wash
- SMT stencil design and procurement
- Design for Manufacturability services
* Quality Control
A quality control team inspects 100%
of the circuit board at different stages of
the process. They are insepcted to the IPC
standards.
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