This checklist was prepared to facilitate
your request for quote. It is split up by
service options. For each service we will
be performing, there is a checklist of documentation
that is required to expedite your request.
Please provide all pertinent documents and
information by email. Use this checklist to
make sure we get the proper documentation.
For Board Layout If Needed
• Schematic
• Net List
• Physical Parameters
For Board Fabrication:
• Gerber files with Part Number and
Revision Level. These includes top, bottom,inner
layers if any, mask, silk and paste layers
• Fabrication Drawing (Gerber, AutoCad
or PDF). RS274X format Preferred
• Drill file(in Ascii Format) with tool
list
For Electronic Assembly (Surface
Mount / Through-hole / BGA / Cable & Harness)
• Complete BOM (Excel, Word
or hard copy format). This is very important.
BOM should include complete part descriptions,
package size, component type, tolerance, value,
reference designators, voltage (if applicable),
and manufacturers with manufacturers' part
number.
The BOM should provide the most accurate information
regarding the placement and omission of all
parts on the board. We use the BOM to program
our surface mount machines and supersedes
assembly drawings. Any placement or omission
of information is listed on the assembly drawing.
That information should also be included on
the BOM. We are not responsible for any discrepancies
between BOM, CAD, Gerbers, and assembly drawing
which will effect delivery schedules.
• Gerber files including Solder paste
stencil file. Silkscreen must show part polarity.
• Assembly Drawing (PDF format Preferred)
this must show reference designators. Dimensional
specifications for non-standard components
such as connectors, headers, sockets, transformers,
LEDs, etc
• Assembly instructions (incl. all special
placements / orientations / component handling
along with any hand or rework instructions.)
• Sample assembled board / cable/Bare
board (if available)
• Rework Instructions
• Electronic "Centroid data"
in ASCII format: (for smt and mixed technology)
.These are the "X" & "Y"
coordinates for the location of the parts
on the board. These coordinates should reflect
the location of the center of the component
body referenced to the same zero point. This
information should also include the respective
component designations as well as the component
rotation. The preferred format for coordinates
is in millimeters.
Components Purchasing (Procurement)
• Complete BOM (as above)
• AVL (approved vendor list)
• Cross Approvals
Testing Requirements (Functional
/ICT/ AOI)
• Test procedures
• Test equipment required
• Estimated test time
Component requirements apply for all components
supplied by the customer and not supplied
by Electronics Integration Inc.
Packaging
SOICs should be supplied in either tubes or
on tape and reel (T&R) with a 12"
leader. PLCC components should be supplied
in trays, tubes, or T&R. QFP components
are to be packaged in trays. To prevent damage
to QFPs, please do not remove from their original
trays and do not break the hermetic seal.
T&Rs are preferred for all components
whenever possible.
Extra Parts
All SMT components provided on T&R should
have a factory-attached leader approximately
12" long before the first component.
When practical, please provide 5% extra for
all parts provided on T&R and 2% extra
for all other forms of packaging. Unused parts
will be returned after the completion of assembly.
First Articles:
The first time we set-up a new assembly for
SMT, it is both important and necessary that
we verify solder paste stencil set-up, placement
programming, feeder set-up and optimization,
placement accuracy and oven profile for proper
reflow of the solder paste with the components
mounted. It is not recommended that these
parameters for proper assembly be learned
"on the fly". The multitudes of
possible problems encountered during this
exercise are far too numerous to list. These
potential problems must be identified and
corrected before the production order is run
through the entire sequence of events required
for proper SMT assembly. It may often be required
that we build 1 or 2 assemblies for purposes
of proofing the set-up. It is possible that
these boards may or may not be usable after
this exercise. We will not mount components
identified as expensive for this proofing
and we request that if you are the supplier
of the boards, please send any extra bare
boards that you may have on hand. These bare
boards may be scrap due to damage or defects
in manufacturing, extras, or possibly an older
revision that has become obsolete, but please
identify them as scrap to be used for test
purposes only.
Stencils:
Electornic Integration Inc. will return stencils
that are not used for a period of one (1)
year to the stencil manufacturer, unless otherwise
noted by the customer.
For Mechanical Services:
• IGES Design Files (.igs)
• Assembly Spec sheets (PDF ok)
• Mechanical BOM
• Assembly instructions
• Sample Box (if available)
• Estimated build time
Expectations / Requirements
• Quantities
• Frequency of builds
• Applicable schedules/Date required
• Packaging/Labeling requirements
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